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invensense inc. 1197 borregas ave , sunnyvale, ca 94089 u.s.a. tel: +1 (408) 9 88 - 7339 fax: +1 (408) 988 - 8104 website: www.invensense.com document number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 1 of 54 mpu - 6000 and mpu - 6050 product specification rev ision 3. 3
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 2 of 54 contents 1 revision history ................................ ................................ ................................ ................................ ... 5 2 purpose and scope ................................ ................................ ................................ ............................. 6 3 product overview ................................ ................................ ................................ ............................... 7 3.1 mpu - 60x0 o verview ................................ ................................ ................................ ........................ 7 4 applications ................................ ................................ ................................ ................................ ........... 9 5 features ................................ ................................ ................................ ................................ ................ 10 5.1 g yroscope f eatures ................................ ................................ ................................ ..................... 10 5.2 a ccelerometer f eatures ................................ ................................ ................................ ............. 10 5. 3 a dditional f eatures ................................ ................................ ................................ ...................... 10 5.4 m otion p rocessing ................................ ................................ ................................ ......................... 11 5.5 c locking ................................ ................................ ................................ ................................ ......... 11 6 electrical cha racteristics ................................ ................................ ................................ ......... 12 6.1 g yroscope s pecifications ................................ ................................ ................................ ............ 12 6.2 a ccelerometer s pecifications ................................ ................................ ................................ ..... 13 6.3 e lectrical and o ther c ommon s pecifications ................................ ................................ ............ 14 6.4 e lectrical s pecifications , c ontinued ................................ ................................ ......................... 15 6.5 e lectrical s pecifications , c ontinued ................................ ................................ ......................... 16 6.6 e lectrical s pecifications , c ontinued ................................ ................................ ......................... 17 6.7 i 2 c t iming c haracterization ................................ ................................ ................................ .......... 18 6.8 spi t iming c haracterization (mpu - 6000 only ) ................................ ................................ ........... 19 6.9 a bsolute m aximum r atings ................................ ................................ ................................ ........... 20 7 applications informa tion ................................ ................................ ................................ .............. 21 7.1 p in o ut and s ignal d escription ................................ ................................ ................................ .... 21 7.2 t ypical o perating c ircuit ................................ ................................ ................................ ............. 22 7.3 b ill of m aterials for e xternal c omponents ................................ ................................ .............. 22 7.4 r ecommended p ower - on p rocedure ................................ ................................ ........................... 23 7.5 b lock d iagram ................................ ................................ ................................ ............................... 24 7.6 o verview ................................ ................................ ................................ ................................ ........ 24 7.7 t hree - a xis mems g yroscope with 16 - bit adc s and s ignal c onditioning ................................ 25 7.8 t hree - a xis mems a ccelerometer with 16 - bit adc s and s ignal c onditioning ........................ 25 7.9 d igital m otion p rocessor ................................ ................................ ................................ ............ 25 7.10 p rimary i 2 c and spi s erial c ommunications i nter faces ................................ ............................ 25 7.11 a uxiliary i 2 c s erial i nterface ................................ ................................ ................................ ...... 26
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 3 of 54 7.12 s elf - t est ................................ ................................ ................................ ................................ ........ 27 7.13 mpu - 60x0 s olution for 9 - axis s ensor f usion u sing i 2 c i nterface ................................ .......... 28 7.14 mpu - 6000 u sing spi i nterface ................................ ................................ ................................ ..... 29 7.15 i nternal c lock g eneration ................................ ................................ ................................ .......... 30 7.16 s ensor d ata r egisters ................................ ................................ ................................ ................. 30 7.17 fifo ................................ ................................ ................................ ................................ ................ 30 7.18 i nterrupts ................................ ................................ ................................ ................................ ...... 30 7.19 d igital - o utput t emperature s ensor ................................ ................................ .......................... 31 7.20 b ias and ldo ................................ ................................ ................................ ................................ .. 31 7.21 c harge p ump ................................ ................................ ................................ ................................ .. 31 8 programmable interru pts ................................ ................................ ................................ ............ 32 8.1 m otion i nterrupt ................................ ................................ ................................ ........................... 33 9 digital interface ................................ ................................ ................................ ............................... 34 9.1 i 2 c and spi (mpu - 6000 only ) s erial i nterfaces ................................ ................................ .......... 34 9.2 i 2 c i nterface ................................ ................................ ................................ ................................ .. 34 9.3 i 2 c c o mmunications p rotocol ................................ ................................ ................................ ...... 34 9.4 i 2 c t erms ................................ ................................ ................................ ................................ ........ 37 9.5 spi i nterface (mpu - 6000 only ) ................................ ................................ ................................ .... 38 10 serial interface con siderations (mpu - 6050) ................................ ................................ .......... 39 10.1 mpu - 6050 s upported i nterfaces ................................ ................................ ................................ . 39 10.2 l ogic l evels ................................ ................................ ................................ ................................ ... 39 10.3 l ogic l evels d iagram for aux _vddio = 0 ................................ ................................ .................. 40 10.4 l ogic l evels d iagram for aux_vddio = 1 ................................ ................................ .................. 41 11 assembly ................................ ................................ ................................ ................................ ............... 42 11.1 o rientation of a xes ................................ ................................ ................................ ...................... 42 11.2 p ackage d imensions ................................ ................................ ................................ ...................... 43 11.3 pcb d esign g uidelines ................................ ................................ ................................ .................. 44 11 .4 a ssembly p recautions ................................ ................................ ................................ .................. 4 5 11.5 s torage s pecifications ................................ ................................ ................................ ................. 48 11.6 p ackage m arking s pecification ................................ ................................ ................................ .... 48 11.7 t ape & r eel s pecification ................................ ................................ ................................ ............. 49 11.8 l abel ................................ ................................ ................................ ................................ ............... 50 11.9 p ackaging ................................ ................................ ................................ ................................ ....... 51 11.10 r epresentative s hipping c arton l abel ................................ ................................ ................... 52
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 4 of 54 12 reliability ................................ ................................ ................................ ................................ ............. 53 12.1 q ualification t est p olicy ................................ ................................ ................................ ............. 53 12.2 q ualification t est p lan ................................ ................................ ................................ ................ 53 13 environmental compli ance ................................ ................................ ................................ ........... 54
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 5 of 54 1 revision history revision date revision description 11/24/2010 1.0 initial release 05/19/2011 2.0 for rev c parts. clarified wording in sections (3.2, 5.1, 5.2, 6.1 - 6.4, 6.6, 6.9, 7, 7.1 - 7.6, 7.11, 7.12, 7.14, 8, 8.2 - 8.4, 10.3, 10.4, 11, 12.2) 0 7/28/ 20 11 2.1 edited s upply current numbers for different modes (section 6.4) 0 8/05/ 20 11 2.2 unit of measure for a ccelerom eter sensitivity changed from lsb/m g to lsb/ g 10/12/2011 2.3 updated accelerometer self test specifications in table 6.2. updated package dimensions (section 11.2). updated pcb design guidelines (section 11.3) 10/1 8 / 20 11 3.0 for rev d parts. updated accelerometer specifications in table 6.2 . updated accelerometer specification note ( section s 8.2, 8.3, & 8.4) . updated qualification test plan (section 12.2). 10/24/2011 3.1 edits for clarity change d operating voltage range to 2.375 v - 3.46v added accelerometer intelligence function increment value of 1m g /lsb (section 6.2) updated absolute maximum rating for acceleration (any axis, unpowered) from 0.3ms to 0.2ms (section 6.9) modified absolute maximum rating for latch - up to level a and 100ma (secti on 6.9 , 12.2 ) 11/16 /2011 3.2 updated self - test respons e specifications for revision d parts dated with date code 1147 (yyww) o r later. edits for clarity a dded gyro self - test (sections 5.1, 6.1, 7.6, 7.12) added min/max limits to accel self - test response (section 6.2) updated accelerometer low power mo de operating currents (section 6 .3) added gyro self test to block diagram (section 7.5) updated packaging labels and descriptions (sections 11.8 & 11.9) 5 /1 6 /2012 3.3 updated gyro and accelerometer self test information (section s 6.1 , 6.2, 7.12 ) updated latch - up information (section 6.9) updated programmable interrupts information (section 8) changed shipment information from maximum of 3 reels (15k units) per shipper box to 5 reels (25k units) per s hipper box (section 11.7 ) updated packing shipping and label information (section s 11.8, 11.9 ) updated reliability references (section 12.2 )
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 6 of 54 2 purpose and scope this product specification provides advanced information regarding the electrical specification and design related information for the mpu - 6000 ? and mpu - 6050 ? motiontracking? devices , collectively called the mpu - 60x0 ? or mpu ? . electrical characteristics ar e based upon design analysis and simulatio n results only. specifications are subject to change without notice. final specifications will be upda ted based upon characterization of production silicon. for references to register map and descriptions of individual registers, please refer to the mpu - 60 00 /mpu - 6050 register map and register descriptions document . the self - test response specifications provided in this document pertain to revision d parts with date codes of 1147 (yyww) or later. please see section 11.6 for package marking description details.
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 7 of 54 3 product overview 3.1 mpu - 60x0 overview motioninterface? is becoming a must - have function being adopted by smartphone and tablet manufacturers due to the enormous value it adds to the end user experience. in smartphones, it finds use in applications such as gesture commands for applications and phone control, enhanced gaming, augmented reality, panoramic photo capture and viewing, and pedestrian and vehicle navigation. with its ability to precisely and accurately track user motions, motiontracking te chnology can convert handsets and tablets into powerful 3d intelligent devices that can be used in applications ranging from health and fitness monitoring to location - based services. key requirements for motioninterface enabled devices are small package s ize, low power consumption, high accuracy and repeatability, high shock tolerance, and application specific performance programmability C all at a low consumer price point. the mpu - 60x0 is the worlds first integrated 6 - axis motiontracking device that comb ines a 3 - axis gyroscope, 3 - axis accelerometer, and a digital motion processor? (dmp) all in a small 4x4x0.9mm package. with its dedicated i 2 c sensor bus, i t directly accepts inputs from an external 3 - axis compass to provide a complete 9 - axis motionfusion ? output. the mpu - 60x0 motiontracking device, with its 6 - axis integration, on - board motionfusion? , and run - time calibration firmware , enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discre te devices , guaranteeing optimal motion performance for consumers. the mpu - 60 x 0 is also designed to interface with multiple non - inertial digital sensors, such as pressure sensors, on its auxiliary i 2 c port. the mpu - 60 x 0 is footprint compatible with the m pu - 30x 0 family. the mpu - 60 x 0 features three 16 - bit analog - to - digital converters (adcs) for digitizing the gyro scope outputs and three 16 - bit adcs for digitizing the accelerometer outputs. for precision tracking of both fast and slow motions, the part s feature a user - programmable gyroscope full - scale range of 250, 500, 1000, and 2000/sec (dps) and a user - programmable accelerometer full - sc ale range of 2 g , 4 g , 8 g , and 16 g . an on - chip 1024 byte fifo buffer helps lower system power consumption by a llowing the system processor to read the sensor data in bursts and then enter a low - power mode as the mpu collects more data. with all the necessary on - chip processing and sensor components required to support many motion - based use cases, the mpu - 60x0 uniq uely enabl es low - power motioninterface applications in portable applications with reduced processing requirements for the system processor . by providing an integrated motionfusion output, the dmp in the mpu - 60x0 offloads the intensive motionprocessing co mp u tation requirements from the system processor, minimizing the need for frequent polling of the motion sensor output. communication with all registers of the device is performed using either i 2 c at 400khz or spi at 1mhz ( mpu - 6000 only) . for applications r equiring faster communications, the sensor and interrupt registers may be read using spi at 20mhz ( mpu - 6000 only) . additional features include an embedded temperature sensor and an on - chip oscillator with 1 % variation over the operating temperature range . by leveraging its patented and volume - proven nasiri - fabrication platform, which integrates mems wafers with companion cmos electronics through wafer - level bonding, invensense has driven the mpu - 60x0 package size down to a revolutionary footprint of 4x4x0. 9mm (qfn), while providing the highest performance, lowest noise, and the lowest cost semiconductor packaging required for handheld consumer electronic devices. the part features a robust 10,000 g shock tolerance, and has programmable low - pass filters for the gyros copes , accelerometers, and the on - chip temperature sensor. for power supply flexibility, the mpu - 60x0 operates from vdd power supply voltage range of 2.375 v - 3.46v . additionally, the mpu - 6050 provides a vlogic reference pin (in addition to its ana log supply pin : vdd), which sets the logic levels of its i 2 c interface. the vlogic voltage may be 1.8v 5% or vdd. the mpu - 6000 and mpu - 6050 are identical, except that the mpu - 6050 supports the i 2 c serial interface only, and has a separate vlogic reference pin. the mpu - 6000 supports both i 2 c and spi interfaces and has a single supply pin, vdd, which is both the devices logic reference supply and the analog supply for the part. the table below ou tlines these differences:
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 8 of 54 primary differences between mpu - 6000 and mpu - 6050 part / item mpu - 6 000 mpu - 6 050 vdd 2.375 v - 3.46v 2.375 v - 3.46v vlogic n/a 1.71v to vdd serial interfaces supported i 2 c, spi i 2 c pin 8 /cs vlogic pin 9 ad0/sdo ad0 pin 23 scl/sclk scl pin 24 sda/sdi sda
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 9 of 54 4 applications ? blurfree ? technology (for video/still image stabilization) ? airsign ? technology (for security/authentication) ? touchanywhere ? technology (for no touch ui application control/navigation) ? motioncommand ? technology (for gesture short - cuts) ? motion - enabled game and application framework ? instantgesture ? ig ? gesture recognition ? location based services, points of interest, and dead reckoning ? handset and portable gaming ? motion - based game controllers ? 3d remote controls for internet c onnected dtvs and set top boxes, 3d mice ? wearable sensors for h ealth, fitness and sports ? toys
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 10 of 54 5 features 5.1 gyroscope features the triple - axis mems gyroscope in the mpu - 60x0 includes a wide range of features: ? digital - output x - , y - , a nd z - axis angular rate sensors (gyros copes ) with a user - programmable full - scale range of 250, 500, 1000, and 2000/sec ? external sync signal connected to the fsync pin supports image, video and gps synchronization ? integrated 16 - bit adcs enable simultaneous sampling of gyros ? enhanced bias and sensitivity temperature stability reduces the need for user calibration ? improved low - frequency noise performance ? digitally - programmable low - pass filter ? gyroscope operating current: 3.6ma ? standby current: 5a ? factory calibrated sensitivity scale factor ? user self - test 5.2 accelerometer features the triple - axis mems accelerometer in mp u - 60x0 includes a wide range of features: ? digital - output tri ple - axis accelerometer with a programmable full scale range of 2 g , 4 g , 8 g and 16 g ? integrated 16 - bit adcs enable simultaneous sampling of accelerometers while requiring no external multiplexer ? accel erometer normal operating current: 500 a ? low power accel erometer mode current: 10a at 1.25hz, 20a at 5hz, 60a at 20hz, 110a at 40hz ? orientation detection and signaling ? tap detection ? user - programmable interrupts ? high - g interrupt ? user self - test 5.3 additional features the mpu - 60 x 0 includes the following additional features: ? 9 - axis motionfusion by the on - chip digital motion processor (dmp) ? auxiliary master i 2 c bus for reading data from external sensors (e.g. , magnetometer) ? 3.9 ma operating current when all 6 motion sensing axes and the dmp are enabled ? vdd supply voltage range of 2.375 v - 3.46v ? flexible vlogic reference voltage supports multiple i 2 c interface voltages ( mpu - 6050 only) ? smallest and thinnest qfn package for portable devices : 4x4x0.9mm ? minim al cross - axis sensitivity between the accelerometer and gyro scope axes ? 1024 byte fifo buffer reduces power consumption by allowing host processor to read the data in bursts and then go in to a low - power mode as the mpu collects more data ? di gital - output temperature sensor ? user - programmable digital filters for gyro scope , accel erometer , and temp senso r ? 10,000 g shock tolerant ? 400khz fast mode i 2 c for communicating with all registers ? 1mhz spi serial interface for communicating with all registers ( mpu - 6000 only) ? 20mhz spi serial interface for reading sensor and i nterrupt registers ( mpu - 6000 only)
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 11 of 5 4 ? mems s tructure hermetically sealed and bonded at wafer level ? rohs and green compliant 5.4 motionprocessing ? internal digital motion processing? (dmp?) engine supports 3d motionprocessing and gesture recognition algorithms ? the mpu - 6 0x0 collects gyro scope and accelerometer data while synchronizing data sa mpling at a user defined rate. the total dataset obtained by the mpu - 6 0x0 includes 3 - axis gyroscope data, 3 - a xis accelerometer data, and temperature data . the mpu s calculated output to the system processo r can also include heading data from a digital 3 - axis third party magnetometer. ? the fifo buffers the complete data set, reducing timing requirements on the system processor by allowing the processor burst read the fifo data . after burst reading the fifo data, the system processor can save power by enter ing a low - power sleep mode while the mpu collects more data. ? programmable interrupt supports features such as gesture recognition, panning, zooming, scrolling, zero - motion det ection, tap detection, and shake detection ? digitally - p rogrammable low - pass filters ? low - power p edometer functionality allows the host processor to sleep while the dmp maintains the step count. 5.5 clocking ? on - chip timing generator 1 % frequency variation over full temperature range ? optional external clock inputs of 32.768khz or 19.2mhz
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 12 of 54 6 electrical characteristics 6.1 gyroscope specifications vdd = 2.375 v - 3.46v , vlogic (mpu - 6050 only) = 1.8v 5% or vdd, t a = 25c parameter conditions min typ max units notes gyroscope sensitivity full - scale range fs_sel= 0 250 o/s fs_sel= 1 500 o/s fs_sel= 2 1000 o/s fs_sel= 3 2000 o/s gyroscope adc word length 16 b its sensitivity scale factor fs_sel=0 131 lsb/(o/s) fs_sel=1 65.5 lsb/(o/s) fs_sel=2 32.8 lsb/(o/s) fs_sel=3 16.4 lsb/(o/s) sensitivity scale factor tolerance 25c - 3 +3 % sensitivity scale factor variation over temperature 2 % nonlinearity best fit straight line; 25c 0.2 % cross - axis sensitivity 2 % gyroscope zero - rate output (zro) initial zro tolerance 25c 20 o/s zro variation over temperature - 40c to +85c 20 o/s power - supply sensitivity (1 - 10hz) sine wave, 100mvpp; vdd=2.5v 0.2 o/s power - supply sensitivity (10 - 250hz) sine wave, 100mvpp; vdd=2.5v 0.2 o/s power - supply sensitivity (250hz - 100khz) sine wave, 100mvpp; vdd=2.5v 4 o/s linear acceleration sensitivity static 0.1 o/s/ g self - test response relative change from factory trim - 14 14 % 1 gyroscope noise performance fs_sel=0 total rms noise dlpfcfg=2 (100hz) 0. 05 o/s - rms low - frequency rms noise bandwidth 1hz to10hz 0.033 o/s - rms rate noise spectral density at 10hz 0.005 o/s/ hz gyroscope mechanical frequencies x - axis 30 33 36 khz y - axis 27 30 33 khz z - axis 24 27 30 khz low pass filter response programmable range 5 256 hz output data rate programmable 4 8,000 hz gyroscope start - up time dlpfcfg=0 zro settling (from power - on) to 1o/s of final 30 ms 1. please refer to the following document for further information on self - test: mpu - 6000/mpu - 6050 register map and descriptions
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 13 of 54 6.2 accelerometer specifications vdd = 2.375 v - 3.46v, vlogic ( mpu - 6050 onl y ) = 1.8v 5% or vdd, t a = 25c parameter conditions min typ max units notes accelerometer sensitivity full - scale range afs_sel=0 2 g afs_sel=1 4 g afs_sel=2 8 g afs_sel=3 16 g adc word length output in twos complement format 16 b its sensitivity scale factor afs_sel=0 16,384 lsb/ g afs_sel=1 8,192 lsb/ g afs_sel=2 4,096 lsb/ g afs_sel=3 2,048 lsb/ g initial calibration tolerance 3 % sensitivity change vs. temperature afs_sel=0 , - 40c to +85c 0.02 %/c nonlinearity best fit straight line 0.5 % cross - axis sensitivity 2 % zero - g output initial calibration tolerance x and y axes 50 m g 1 z axis 80 m g zero - g level change vs. temperature x and y axes, 0c to + 70c 35 z axis, 0c to + 70c 60 m g self test response relative change from factory trim - 14 14 % 2 noise performance power spectral density @10hz, afs_sel=0 & odr=1khz 400 ? g / hz low pass filter response programmable range 5 26 0 hz output data rate programmable range 4 1,000 hz intelligence function increment 32 m g /lsb 1. typical zero - g initial calibration tolerance value after msl3 preconditioning 2. please refer to the following document for further information on self - test: mpu - 6000/mpu - 6050 register map and descriptions
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 14 of 54 6.3 electrical and other common specifications vdd = 2.375 v - 3.46v, vlogic ( mpu - 6050 only) = 1.8v 5% or vdd, t a = 25c parameter conditions min typ max units notes temperature sensor range - 40 to +85 c sensitivity untrimmed 340 lsb/oc temperature offset 35 o c - 521 lsb linearity best fit straight line ( - 4 0c to +85c) 1 c vdd power supply operating voltages 2.375 3.46 v normal operating current gyroscope + accelerometer + dmp 3.9 ma gyroscope + accelerometer (dmp disabled) 3.8 ma gyroscope + dmp (accelerometer disabled) 3.7 ma gyroscope only (dmp & accelerometer disabled) 3.6 ma accelerometer only (dmp & gyroscope disabled) 500 a accelerometer low power mode current 1 .25 hz update rate 10 a 5 hz update rate 20 a 20 hz update rate 7 0 a 40 hz update rate 14 0 a full - chip idle mode supply current 5 a power supply ramp rate monotonic ramp. ramp rate is 10% to 90% of the final value 100 ms vlogic reference voltage mpu - 6050 only voltage range vlogic must be vdd at all times 1.71 vdd v power supply ramp rate monotonic ramp. ramp rate is 10% to 90% of the final value 3 ms normal operating current 100 a temperature range specified temperature range performance parameters are not applicable beyond specified temperature range - 40 +85 c
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 15 of 54 6.4 electrical specifications , continued vdd = 2.375 v - 3.46v, vlogic ( mpu - 6050 only) = 1.8v 5% or vdd, t a = 25c parameter conditions min typ max units notes serial interface spi operating frequency, all registers read/write mpu - 6000 only, low speed characterization 100 10% khz mpu - 6000 only, high speed characterization 1 10% mhz spi operating frequency, sensor and interrupt registers read only mpu - 6000 only 20 10% mhz i 2 c operating frequency all registers, fast - mode 400 khz all registers, standard - m ode 100 khz i 2 c address ad0 = 0 1101000 ad0 = 1 1101001 digital inputs (sdi/sda, ad0, sclk/scl, fsync, /cs, clkin) v ih , high level input voltage mpu - 6000 0.7*vdd v mpu - 6050 0.7*vlogic v v il , low level input voltage mpu - 6000 0.3*vdd v mpu - 6050 0.3*vlogic v c i , input capacitance < 5 pf digital output ( sdo, int) v oh , high level output voltage r load =1m? ; mpu - 6000 0.9*vdd v r load =1m? ; mpu - 6050 0.9*vlogic v v ol1 , low - level output voltage r load =1m? ; mpu - 6000 0.1*vdd v r load =1m? ; mpu - 6050 0.1*vlogic v v ol.int1 , int low - level output voltage open=1, 0.3ma sink current 0.1 v output leakage current open=1 100 na t int , int pulse width latch_int_en=0 50 s digital output (clkout) v oh , high level output voltage v ol1 , low - level output voltage r load =1m? r load =1m? 0.9*vdd 0.1*vdd v v
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 16 of 54 6.5 electrical specifications, c ontinued typical operating circuit of section 7 .2, vdd = 2.375 v - 3.46v, vlogic (mpu - 6050 only) = 1.8v5% or vdd, t a = 25c parameters conditions typical units notes primary i 2 c i/o (scl, sda) v il , low - level input voltage mpu - 6000 - 0.5 to 0.3* vdd v v ih , high - level input voltage mpu - 6000 0.7* vdd to vdd + 0.5v v v hys , hysteresis mpu - 6000 0.1* vdd v vil, low level input voltage mpu - 6050 - 0.5v to 0.3*vlogic v vih, high - level input voltage mpu - 6050 0.7*vlogic to vlogic + 0.5v v vhys, hysteresis mpu - 6050 0.1*vlogic v v ol1 , low - level output voltage 3ma sink current 0 to 0.4 v i ol , low - level output current v ol = 0.4v 3 m a v ol = 0.6v 5 ma output leakage current 100 na t of , output fall time from v ihmax to v ilmax c b bus capacitance in p f 20+0.1c b to 250 ns c i , capacitance for each i/o pin < 10 pf auxiliary i 2 c i/o (aux_cl, aux_da) mpu - 6050 : aux_vddio =0 v il , low - level input voltage - 0.5v to 0.3*vlogic v v ih , high - level input voltage 0.7*vlogic to vlogic + 0.5v v v hys , hysteresis 0.1*vlogic v v ol1 , low - level output voltage vlogic > 2v; 1ma sink current 0 to 0.4 v v ol3 , low - level output voltage vlogic < 2v; 1ma sink current 0 to 0.2*vlogic v i ol , low - level output current v ol = 0.4v v ol = 0.6v 1 1 ma ma output leakage current 100 na t of , output fall time from v ihmax to v ilmax c b bus capacitance in pf 20+0.1c b to 250 ns c i , capacitance for each i/o pin < 10 pf auxiliary i 2 c i/o (aux_cl, aux_da) mpu - 6050: aux_vddio = 1 ; mpu - 6000 v il , low - level input voltage - 0.5 to 0.3*vdd v v ih , high - level input voltage 0.7*vdd to vdd+0.5v v v hys , hysteresis 0.1*vdd v v ol1 , low - level output voltage 1ma sink current 0 to 0.4 v i ol , low - level output current v ol = 0.4v v ol = 0.6v 1 1 ma ma output leakage current 100 na t of , output fall time from v ihmax to v ilmax c b bus cap. in pf 20+0.1c b to 250 ns c i , capacitance for each i/o pin < 10 pf
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 17 of 54 6.6 electrical specifications, c ontinued typical operating circuit of section 7 .2, vdd = 2.375 v - 3.46v, vlogic (mpu - 6050 only) = 1.8v5% or vdd, t a = 25c parameters conditions min typical max units notes internal clock source clk_sel=0,1,2,3 gyro scope sample rate, fast dlpfcfg=0 sampleratediv = 0 8 khz gyro scope sample rate, slow dlpfcfg=1,2,3,4,5, or 6 sampleratediv = 0 1 khz accel erometer sample rate 1 khz reference clock output clkouten = 1 1.024 mhz clock frequency initial tolerance clk_sel=0, 25c - 5 +5 % clk_sel=1,2,3; 25c - 1 +1 % frequency variation over temperature clk_sel=0 - 15 to +10 % clk_sel=1,2,3 1 % pll settling time clk_sel=1,2,3 1 10 ms external 32.768khz clock clk_sel=4 external clock frequency 32.768 khz external clock allowable jitter cycle - to - cycle rms 1 to 2 s gyro scope sample rate, fast dlpfcfg=0 sampleratediv = 0 8.192 khz gyro scope sample rate, slow dlpfcfg=1,2,3,4,5, or 6 sampleratediv = 0 1.024 khz accel erometer sample rate 1.024 khz reference clock output clkouten = 1 1.0486 mhz pll settling time 1 10 ms external 19.2mhz clock clk_sel=5 external clock frequency 19.2 mhz gyro scope sample rate full programmable range 3.9 8000 hz gyro scope sample rate, fast mode dlpfcfg=0 sampleratediv = 0 8 khz gyro scope sample rate, slow mode dlpfcfg=1,2,3,4,5, or 6 sampleratediv = 0 1 khz accel erometer sample rate 1 khz reference clock output clkouten = 1 1.024 mhz pll settling time 1 10 ms
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 18 of 54 6.7 i 2 c timing characterization typical operating circuit of section 7 .2, vdd = 2.375 v - 3.46v, vlogic ( mpu - 6050 only) = 1.8v 5% or vdd, t a = 25c parameters conditions min typical max units notes i 2 c timing i 2 c fast - mode f scl , scl clock frequency 400 khz t hd.sta , (repeated) start condition hold time 0.6 s t low , scl low period 1.3 s t high , scl high period 0.6 s t su.sta , repeated start condition setup time 0.6 s t hd.dat , sda data hold time 0 s t su.dat , sda data setup time 100 ns t r , sda and scl rise time c b bus cap. from 10 to 400pf 20+0.1c b 300 ns t f , sda and scl fall time c b bus cap. from 10 to 400pf 20+0.1c b 300 ns t su.sto , stop condition setup time 0.6 s t buf , bus free time between stop and start condition 1.3 s c b , capacitive load for each bus line < 400 pf t vd.dat , data valid time 0.9 s t vd.ack , data valid acknowledge time 0.9 s note: timing characteristics apply to both primary and auxiliary i 2 c bus i 2 c bus timing diagram
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 19 of 54 6.8 spi timing characterization ( mpu - 6 000 only) typical operating circuit of section 7 .2, vdd = 2.375 v - 3.46v, vlogic ( mpu - 6050 only) = 1.8v 5% or vdd, t a = 2 5c, unless otherwise noted. parameters conditions min typical max units notes spi timing f sclk , sclk clock frequency 1 mhz t low , sclk low period 400 ns t high , sclk high period 400 ns t su.cs , cs setup time 8 ns t hd.cs , cs hold time 500 ns t su.sdi , sdi setup time 11 ns t hd.sdi , sdi hold time 7 ns t vd.sdo , sdo valid time c load = 20pf 100 ns t hd.sdo , sdo hold time c load = 20pf 4 ns t dis.sdo , sdo output disable time 10 ns spi bus timing diagram
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 20 of 54 6.9 absolute maximum ratings stress above those listed as absolute maximum ratings may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these conditions is not implied. exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. parameter rating supply voltage, vdd - 0.5v to +6v vlogic input voltage level (mpu - 6050) - 0.5v to vdd + 0.5v regout - 0.5v to 2v input voltage level (clkin, aux _da, ad0, fsync, int, scl, sda) - 0.5v to vdd + 0.5v cpout (2. 5 v vdd 3.6v )
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 21 of 54 7 application s information 7.1 pin out and signal description pin number mpu - 6000 mpu - 6050 pin name pin description 1 y y clkin optional external reference clock input. connect to gnd if unused. 6 y y aux_da i 2 c master serial data, for connecting to external sensors 7 y y aux_cl i 2 c master serial clock, for connecting to external sensors 8 y /cs spi chip select (0=spi mode) 8 y vlogic digital i/o supply voltage 9 y ad0 / sdo i 2 c slave address lsb (ad0); spi serial data output (sdo) 9 y ad0 i 2 c slave address lsb (ad0) 10 y y regout regulator filter capacitor connection 11 y y fsync frame synchronization digital input . connect to gnd if unused. 12 y y int interrupt digital output (totem pole or open - drain) 13 y y vdd power supply voltage and digital i/o supply voltage 18 y y gnd power supply ground 19, 21 y y resv reserved. do not connect. 20 y y cpout charge pump capacitor connection 22 y y clkout system clock output 23 y scl / sclk i 2 c serial clock (scl); spi serial clock (sclk) 23 y scl i 2 c serial clock (scl) 24 y sda / sdi i 2 c serial data (sda); spi serial data input (sdi) 24 y sda i 2 c serial data (sda) 2, 3, 4, 5, 14, 15, 16, 17 y y nc not internally connected. may be used for pcb trace routing. m p u - 6 0 0 0 m p u - 6 0 5 0 + z + x + y 7 8 9 1 0 1 1 1 2 a u x _ c l v l o g i c a d 0 r e g o u t f s y n c i n t 1 3 1 8 1 7 1 6 1 5 1 4 n c n c n c v d d n c g n d 6 1 2 3 4 5 n c n c n c a u x _ d a n c c l k i n 2 4 2 3 2 2 2 1 2 0 1 9 r e s v c p o u t r e s v c l k o u t s c l s d a m p u - 6 0 5 0 q f n p a c k a g e 2 4 - p i n , 4 m m x 4 m m x 0 . 9 m m o r i e n t a t i o n o f a x e s o f s e n s i t i v i t y a n d p o l a r i t y o f r o t a t i o n t o p v i e w + z + y + x 7 8 9 1 0 1 1 1 2 a u x _ c l / c s a d 0 / s d o r e g o u t f s y n c i n t 1 3 1 8 1 7 1 6 1 5 1 4 n c n c n c v d d n c g n d 6 1 2 3 4 5 n c n c n c a u x _ d a n c c l k i n 2 4 2 3 2 2 2 1 2 0 1 9 r e s v c p o u t r e s v c l k o u t s c l / s c l k s d a / s d i m p u - 6 0 0 0 q f n p a c k a g e 2 4 - p i n , 4 m m x 4 m m x 0 . 9 m m t o p v i e w
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 22 of 54 7.2 typical operating circuit 7.3 bill of material s for external components component label specification quantity regulator filter capacitor (pin 10) c1 ceramic, x7r, 0.1f 10%, 2v 1 vdd bypass capacitor ( pin 13 ) c2 ceramic, x7r, 0.1f 10%, 4v 1 charge pump capacitor (pin 20) c3 ceramic, x7r, 2.2nf 10%, 50v 1 vlogic bypass capacitor (pin 8) c4* ceramic, x7r, 10nf 10%, 4v 1 * mpu - 6050 only. a d 0 / s d o t y p i c a l o p e r a t i n g c i r c u i t s 7 8 9 1 0 1 1 1 2 1 3 1 8 1 7 1 6 1 5 1 4 6 1 2 3 4 5 2 4 2 3 2 2 2 1 2 0 1 9 m p u - 6 0 0 0 c l k i n / c s g n d g n d g n d f s y n c i n t g n d v d d s c l / s c l k s d a / s d i c 3 2 . 2 n f c 1 0 . 1 f c 2 0 . 1 f a d 0 7 8 9 1 0 1 1 1 2 1 3 1 8 1 7 1 6 1 5 1 4 6 1 2 3 4 5 2 4 2 3 2 2 2 1 2 0 1 9 m p u - 6 0 5 0 c l k i n g n d g n d g n d f s y n c i n t g n d v d d s c l s d a c 3 2 . 2 n f c 1 0 . 1 f c 2 0 . 1 f g n d v l o g i c c 4 1 0 n f a u x _ c l a u x _ d a a u x _ c l a u x _ d a c l k o u t c l k o u t
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 23 of 54 7.4 recommended power - on procedure t v l g r v l o g i c v d d t v d d r a l l v o l t a g e s a t 0 v p o w e r - u p s e q u e n c i n g 1 . v l o g i c a m p l i t u d e m u s t a l w a y s b e v d d a m p l i t u d e 2 . t v d d r i s v d d r i s e t i m e : t i m e f o r v d d t o r i s e f r o m 1 0 % t o 9 0 % o f i t s f i n a l v a l u e 3 . t v d d r i s 1 0 0 m s 4 . t v l g r i s v l o g i c r i s e t i m e : t i m e f o r v l o g i c t o r i s e f r o m 1 0 % t o 9 0 % o f i t s f i n a l v a l u e 5 . t v l g r i s 3 m s 6 . t v l g - v d d i s t h e d e l a y f r o m t h e s t a r t o f v d d r a m p t o t h e s t a r t o f v l o g i c r i s e 7 . t v l g - v d d i s 0 8 . v d d a n d v l o g i c m u s t b e m o n o t o n i c r a m p s 9 0 % 1 0 % 9 0 % 1 0 % t v l g - v d d
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 24 of 54 7.5 block diagram 7.6 overview the mpu - 6 0x0 is comprised of the following key blocks and functions: ? three - axis mems rate gyroscope sensor with 16 - bit adcs and signal conditioning ? three - axis mems accelerometer sensor with 16 - bit adcs and signal conditioning ? digital motion processor (dmp) engine ? primary i 2 c and spi ( mpu - 6 000 only) serial communications interfaces ? auxiliary i 2 c serial interface for 3 rd party magnetometer & other sensors ? clocking ? sensor data registers ? fifo ? interrupts ? digital - output temperature sensor ? gyrosc ope & accelerometer self - test ? bias and ldo ? charge pump c l o c k m p u - 6 0 x 0 c h a r g e p u m p ( / c s ) a d 0 / ( s d o ) s c l / ( s c l k ) s d a / ( s d i ) t e m p s e n s o r a d c a d c z g y r o a d c y g y r o d i g i t a l m o t i o n p r o c e s s o r ( d m p ) f s y n c 2 2 1 8 9 2 3 2 4 1 1 s l a v e i 2 c a n d s p i s e r i a l i n t e r f a c e m a s t e r i 2 c s e r i a l i n t e r f a c e c l o c k c p o u t s e r i a l i n t e r f a c e b y p a s s m u x 7 6 a u x _ c l a u x _ d a i n t 1 2 2 0 f a c t o r y c a l i b r a t i o n i n t e r r u p t s t a t u s r e g i s t e r v d d b i a s & l d o g n d r e g o u t 1 3 1 8 1 0 n o t e : p i n n a m e s i n r o u n d b r a c k e t s ( ) a p p l y o n l y t o m p u - 6 0 0 0 p i n n a m e s i n s q u a r e b r a c k e t s [ ] a p p l y o n l y t o m p u - 6 0 5 0 z a c c e l y a c c e l x a c c e l a d c a d c a d c c l k i n c l k o u t a d c x g y r o s i g n a l c o n d i t i o n i n g f i f o c o n f i g r e g i s t e r s s e n s o r r e g i s t e r s s e l f t e s t [ v l o g i c ] 8 s e l f t e s t s e l f t e s t s e l f t e s t s e l f t e s t s e l f t e s t
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 25 of 54 7.7 three - axis mems gyroscope with 16 - bit adcs and signal conditioning the mpu - 6 0x0 consists of three independent vibratory mems rate gyroscopes, which detect rotation about the x - , y - , and z - a xes. when the gyros are rotated about any of the sense axes, the coriolis effect causes a vibration that is detected by a capacitive pickoff. the resulting signal is amplified, demodulated, and filtered to produce a voltage that is proportional to the ang ular rate. this voltage is digitized using individual on - chip 16 - bit analog - to - digital converters (adcs) to sample each axis. the full - scale range of the gyro sensors may be digitally programmed to 250, 500, 1000, or 2000 degrees per second (dps). t he adc sample rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user - selectable low - pass filters enable a wide range of cut - off frequencies. 7.8 three - axis mems accelerometer with 16 - bit adcs and signal conditioning the mpu - 60x0s 3 - a xis accelerometer uses separate proof masses for each axis. acceleration along a particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the displacement differentially. the mpu - 60x0s architecture reduces the accelerometers susceptibility to fabrication variations as well as to thermal drift. when the device is placed on a flat surface, it will measure 0 g on the x - and y - axes and +1 g on the z - axis. the a ccelerometer s scale factor is calibrated at the factory and is nominally independent of supply voltage. each sensor has a dedicated sigma - delta adc for providing digital outputs. the full scale range of the digital output can be adjusted to 2 g , 4 g , 8 g , or 16 g . 7.9 digital motion processor the embe dded digital motion processor (dmp) is located within the mpu - 60x0 and offloads co mpu tation of motion processing algorithms from the host processor. the dmp acquires data from accelerometers, gyroscopes, and additional 3 rd party sensors such as magnetometers, and processes the data. the resulting data can be read from the dmps registers, or can be buffered in a fifo. the dmp has access to one of the mpu s external pins, which can be used for generating interrupts. the purpose of the dmp is to offload both timing requirements and processing power from the host processor. typically, motion processing algorithms should be run at a high rate, often around 200hz, in order to provide accurate results with low latency. this is required even if the application updates at a much lower rate; for example, a low power user interface may update as slowly as 5hz, but the motion processing should still run at 200hz. the dmp can be used as a tool in order to minimize power, simplify timing, simpl ify the software architecture, and save valuable mips on the host processor for use in the application. 7.10 primary i 2 c and spi serial communications interfaces the mpu - 6 0x0 communicates to a system processor using either a spi ( mpu - 6 000 only) or an i 2 c seria l interface. t he mpu - 60x0 always act s as a slave when communicating to the system processor . the lsb of the of the i 2 c slave address is set by pin 9 (ad0). the logic levels for communications between the mpu - 60x0 and its master are as follows: ? mpu - 6000 : the logic level for communications with the master is set by the voltage on vdd ? mpu - 6050 : the logic level for communications with the master is set by the voltage on vlogic for further information regarding the logic levels of the mpu - 6050, ple ase refer to section 10 .
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 26 of 54 7.11 auxiliary i 2 c serial interface the mpu - 6 0x0 has a n auxiliary i 2 c bus for communicating to an off - chip 3 - a xis digital output magnetometer or other sensors . this bus has two operating modes: ? i 2 c master mode : t he mpu - 6 0x0 acts as a master to a ny external sensors connected to the auxiliary i 2 c bus ? pass - through mode : t he mpu - 6 0x0 directly connects the primary and auxiliary i 2 c buses together, allow ing the system processor to directly communicate with any extern al sensors . auxiliary i 2 c bus modes of operation: ? i 2 c master mode : a llows the mpu - 6 0x0 to directly access the data registers of external digital sensors , such as a magnetometer . in this mode, the mpu - 6 0x0 directly obtains data from auxiliary sensors , allowing the on - chip dmp to generate sensor fusion data without intervention from the system applications processor. for example, in i 2 c m aster mode, the mpu - 6 0x0 can be configured to perform burst reads, returning the following data from a magnetometer : ? x magnetometer data (2 bytes) ? y magnetometer data (2 bytes) ? z magnetometer data (2 bytes) the i 2 c master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. a fifth sensor can be configured to work single byte read/write mode. ? pass - through mode : a llows an external system processor to act as master and directly communicate to the external sensor s connected to the auxiliary i 2 c bus pins ( aux _da and aux_c l). in this mode, the auxiliary i 2 c bus control logic ( 3 rd party sensor i nterface block) of the mpu - 6 0x0 is disabled, and the auxiliary i 2 c pins aux_ da and aux_c l (pins 6 and 7) are connected to the main i 2 c bus (pins 23 an d 24) through analog switches. pass - through mode is useful for configuring the external sensor s , or for keeping the mpu - 6 0x0 in a low - power mode when only the external sensor s are used. in pass - through mode the system processor can still access mpu - 60x0 data through the i 2 c interface. auxiliary i 2 c bus io logic levels ? mpu - 6000 : the logic level of the auxiliary i 2 c bus is vdd ? mpu - 6050 : the logic level of the auxiliary i 2 c bus can be programmed to be either vdd or vlogic for further information regarding the mpu - 6050s logic levels, please refer to section 10.2.
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 27 of 54 7.12 self - test please refer to the mpu - 6000/mpu - 6050 register map and register descriptions document for more details on self test. self - test allows for the testing of the mechanical and electrical portions of the sensors. the self - test for each measurement axis can be a ctivated by means of the g yro scope and a ccel erometer self - test registers (registers 13 to 16) . when self - test is activated, the electronics cause the sensors to be actuated and produce an output signal. the output signal is used to observe the self - test response. the self - test response is defined as follows: self - test response = sensor output with self - test enabled C sensor output without self - test enabled the self - test response for each accelerometer axis is defined in the accelerometer specification tab le (section 6.2), while that for each gyroscope axis is defined in the gyroscope specification table (section 6.1). when the value of the self - test response is within the min/max limits of the product specification, the part has passed self test. when th e self - test response exceeds the min/max values, the part is deemed to have failed self - test. code for operating self test code is included within the motionapps software provided by invensense.
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 28 of 54 7.13 mpu - 60x 0 s olution for 9 - axis sensor fusion using i 2 c inter face in the figure below, the system processor is an i 2 c master to the mpu - 60x 0. in addition, the mpu - 60x 0 is an i 2 c master to the optional external compass sensor. the mpu - 60x 0 has limited capabilities as an i 2 c master, and depends on the system processor to manage the initial configuration of any auxiliary sensors. the mpu - 60x 0 has an interface bypass multiplexer , which connects the system processor i 2 c bus pins 23 and 24 (sda and scl) directly to the auxiliary sensor i 2 c bus pins 6 and 7 (aux_da and aux_cl). once the auxiliary sensors ha ve been configured by the system processor, the interface bypass mu ltiplexer should be disabled so that the mpu - 60x 0 auxiliary i 2 c master can take control of the sensor i 2 c bus and gather data from th e auxiliary sensor s . for further information regarding i 2 c m aster control, please refer to section 10. m p u - 6 0 x 0 a d 0 / s d o s c l / s c l k s d a / s d i d i g i t a l m o t i o n p r o c e s s o r ( d m p ) 9 2 3 2 4 s e n s o r m a s t e r i 2 c s e r i a l i n t e r f a c e 7 6 a u x _ c l a u x _ d a i n t e r r u p t s t a t u s r e g i s t e r i n t 1 2 v d d b i a s & l d o g n d r e g o u t 1 3 1 8 1 0 f i f o c o n f i g r e g i s t e r s e n s o r r e g i s t e r f a c t o r y c a l i b r a t i o n / c s 8 s l a v e i 2 c o r s p i s e r i a l i n t e r f a c e c o m p a s s s c l s d a s y s t e m p r o c e s s o r i n t e r f a c e b y p a s s m u x s c l s d a v d d v d d o r g n d i 2 c p r o c e s s o r b u s : f o r r e a d i n g a l l s e n s o r d a t a f r o m m p u a n d f o r c o n f i g u r i n g e x t e r n a l s e n s o r s ( i . e . c o m p a s s i n t h i s e x a m p l e ) i n t e r f a c e b y p a s s m u x a l l o w s d i r e c t c o n f i g u r a t i o n o f c o m p a s s b y s y s t e m p r o c e s s o r o p t i o n a l s e n s o r i 2 c b u s : f o r c o n f i g u r i n g a n d r e a d i n g f r o m e x t e r n a l s e n s o r s
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 29 of 54 7.14 mpu - 6000 using spi interface in the figure below, the system processor is an spi master to the mpu - 6000. pins 8, 9, 23, and 24 are used to support the /cs, sdo, sclk, and sdi signals for spi communications . because the se spi pins are shared with the i 2 c slave pins ( 9, 23 and 24 ) , the system processor cannot access the auxiliary i 2 c bus through the i nterface bypass mu ltiplexer , which connects the processor i 2 c interface pins to the sensor i 2 c interface pins. since the mpu - 60 0 0 has limited capabilities as an i 2 c master, and depends on the system processor to manage the initial configuration of any auxiliary sensors, another method must be used for programming the sensors on the auxiliary sensor i 2 c bus pins 6 and 7 (aux_da and aux_cl). when using spi communications between the mpu - 60 0 0 and the system processor, configuration of devices on the auxili ary i 2 c sensor bus can be achieved by using i 2 c slave s 0 - 4 to perform read and write transactions on any device and register on the auxiliary i 2 c bus. the i 2 c slave 4 interface can be used to perform only single byte read and write transactions. once the e xternal sensors have been configured, the mpu - 6000 can perform single or multi - byte reads using the sensor i 2 c bus. the read results from the slave 0 - 3 controller s can be written to the fifo buffer as well as to the external sensor registers. for further information regarding the control of the mpu - 60x0s auxiliary i 2 c interfa ce, please refer to the mpu - 6000/mpu - 6050 register map and register descriptions document. m p u - 6 0 0 0 a d 0 / s d o s c l / s c l k s d a / s d i d i g i t a l m o t i o n p r o c e s s o r ( d m p ) 9 2 3 2 4 s e n s o r m a s t e r i 2 c s e r i a l i n t e r f a c e i n t e r r u p t s t a t u s r e g i s t e r i n t 1 2 v d d b i a s & l d o g n d r e g o u t 1 3 1 8 1 0 f i f o c o n f i g r e g i s t e r s e n s o r r e g i s t e r f a c t o r y c a l i b r a t i o n / c s 8 s l a v e i 2 c o r s p i s e r i a l i n t e r f a c e s y s t e m p r o c e s s o r i n t e r f a c e b y p a s s m u x s d i s c l k s d o / c s p r o c e s s o r s p i b u s : f o r r e a d i n g a l l d a t a f r o m m p u a n d f o r c o n f i g u r i n g m p u a n d e x t e r n a l s e n s o r s 7 6 a u x _ c l a u x _ d a c o m p a s s s c l s d a o p t i o n a l i 2 c m a s t e r p e r f o r m s r e a d a n d w r i t e t r a n s a c t i o n s o n s e n s o r i 2 c b u s . s e n s o r i 2 c b u s : f o r c o n f i g u r i n g a n d r e a d i n g d a t a f r o m e x t e r n a l s e n s o r s
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 30 of 54 7.15 internal clock generation the mpu - 60x0 has a flexible clocking scheme, allowing a variety of internal or external clock sources to be used for the internal synchronous circuitry. this synchronous circuitry includes the signal conditioning and adcs, the dmp, and various control circuits and re gisters. an on - chip pll provides flexibility in the allowable inputs for generating this clock. allowable internal sources for generating the internal clock are: ? an internal relaxation oscillator ? any of the x, y, or z gyros (mems oscillators with a variat ion of 1 % over temperature) allowable external clocking sources are: ? 32.768khz square wave ? 19.2mhz square wave selection of the source for generating the internal synchronous clock depends on the availability of external sources and the requirements fo r power consumption and clock accuracy. t hese requirements w ill most likely vary by mode of operation. for example, in one mode, where the biggest concern is power consumption, the user may wish to operate the digital motion processor of the mpu - 60x0 to p rocess accelerometer data, while keeping the gyros off. in this case, the internal relaxation oscillator is a good clock choice. however, in another mode, where the gyros are active, selecting the gyros as the clock source provides for a more accurate cl ock source. clock accuracy is important, since timing errors directly affect the distance and angle calculations performed by the digital motion processor ( and by extension, by any processor). there are also st art - up conditions to consider. when the mpu - 60x0 first starts up, the device uses its internal clock until programmed to operate from another source. this allows the user, for example, to wait for the mems oscillators to stabilize before they are selected as the clock source. 7.16 sensor data registers the sensor data registers contain the latest gyro, accelerometer, auxiliary sensor, and temperature measurement data. they are read - only registers, and are accessed via the serial interface. data from these registers may be read anytime. h owever, the i nterrupt function may be used to determi ne when new data is available. for a table of interrupt sources please refer to section 8. 7.17 fifo the mpu - 60x0 contains a 1024 - byte fifo register that is accessible via the serial interface. the fifo configuration reg ister determines which data is written into the fifo. p ossible choices include gyro data, accelerometer data, temperature readings, auxiliary sensor readings, and fsync input. a fifo counter keeps track of how many bytes of valid data are contained in the fifo. the fifo register supports burst reads. the interrupt function may be used to determi ne when new data is available. for further information regarding the f ifo, please refer to the mpu - 600 0 /mpu - 6050 register map and register descriptions document. 7.18 interrupts interrupt functionality is configured via the interrupt configuration register. items that are configurable include the int pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. items that can trigger an interrupt are (1) clock generator locked to new reference oscillator (used when switching clock
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 31 of 54 sources); (2) new data is available to be read (from the fifo and data registers); (3) accelerometer event interrupts; and (4) the mpu - 60x0 did not receive an acknowledge from an auxiliary sensor on the secondary i 2 c bus. the interrupt status can be read from the interrupt status register. for further information regarding interrupts, please refer to the mpu - 60x0 register map and register descriptions document. for infor mation regarding the mpu - 60x0s accelerometer event interrupts, please refer to sectio n 8 . 7.19 digital - output temperature sensor an on - chip temperature sensor and adc are used to measure the mpu - 60x0 die temperature. the readings from the adc can be read fro m the fifo or the sensor data registers. 7.20 bias and ldo the bias and ldo section generates the internal supply and the reference voltages and currents required by the mpu - 60x0. its two inputs are an unregulated vdd of 2.375 to 3 . 46 v and a vlogic logic reference supply voltage of 1.71v to vdd ( mpu - 6050 only). the ldo output is bypassed by a capacitor at regout. for further details on the capacitor, please refer to the bill of m aterials for external components (section 7.3). 7.21 charge pump an on - board char ge pump generates the high voltage required for the mems oscillators. its output is bypassed by a capacitor at cpout. for further details on the capacitor, please refer to the bill of materials for external components (section 7.3).
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 32 of 54 8 programmable interrup ts the mpu - 60x0 has a programmable interrupt system which can generate an interrupt signal on the int pin. status flags indicate the source of an interrupt. interrupt sources may be enabled and disabled individually. table of interrupt sources interrupt name module motion detection motion fifo overflow fifo data ready sensor registers i 2 c master errors: lost arbitration, nacks i 2 c master i 2 c slave 4 i 2 c master for information regarding the interrupt enable/disable registers and flag registers , please refer to the mpu - 6000/mpu - 6050 register map and register descriptions document. some int errupt sources are explained below.
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 33 of 54 8.1 motion interru p t the mpu - 60x0 provides motion detection capability . accelerometer measurements are passed through a confi gurable digital high pass filter (dhpf) in order to eliminate bias due to gravity. a qualifying motion sample is one where the high passed sample from any axis has an absolute value exceeding a user - programmable threshold. a counter increments for each qua lifying sample, and decrements for each non - qualifying sample. once the counter reaches a user - programmable counter threshold, a motion interrupt is triggered. the axis and polarity which caused the interrupt to be triggered is flagged in the mot_detect_st atus register. motion detection has a configurable acceleration threshold mot_thr specified in 1 m g increments . the counter threshold mot_dur i s specified in 1 ms increments . the decrement rate for non - qualifying samples is also configurable. the mot_detect_ctrl register allows the user to specify whether a non - qualifying sample makes the counter reset to zero, or decrement in steps of 1, 2, or 4. the flow chart below explains how the motion interrupt should be used. please refer to the mpu - 6000/m pu - 6050 register map and register descriptions document for descriptions of the registers referenced in the flow chart.
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 34 of 54 9 digital interface 9.1 i 2 c and spi ( mpu - 6000 only) serial interfaces the internal registers and memory of the mpu - 6000 / mpu - 6050 can be accessed using either i 2 c at 400 khz or spi at 1mhz ( mpu - 6000 only). spi operates in four - wire mode. serial interface pin number mpu - 6000 mpu - 6050 pin name pin description 8 y /cs spi chip select (0=spi enable ) 8 y vlogic digital i/o supply voltage. vlogic must be vdd at all times. 9 y ad0 / sdo i 2 c slave address lsb (ad0); spi serial data output (sdo) 9 y ad0 i 2 c slave address lsb 23 y scl / sclk i 2 c serial clock (scl); spi serial clock (sclk) 23 y scl i 2 c serial clock 24 y sda / sdi i 2 c serial data (sda); spi serial data input (sdi) 24 y sda i 2 c serial data note : to prevent switching into i 2 c mode when using spi ( mpu - 6000 ), the i 2 c interface should be disabled by setting the i 2c_if_dis configuration bit . setting this bit should be performed immediately after waiting for the time specified by the start - up time for reg ister read/write in section 6.3 . for further information regarding the i2c_if_dis bit, please refer to the mpu - 600 0 /mpu - 6050 register map and register descriptions document. 9.2 i 2 c interface i 2 c is a two - wire interface comprised of the signals serial data (sda) and serial clock (scl). in general, the lines are open - drain and bi - directional. in a generalized i 2 c interface implementation, at tached devices can be a master or a slave. the master device puts the slave address on the bus, and the slave device with the matching address acknowledges the master. the mpu - 60x0 always operates as a slave device when communicating to the system processor, which thus acts as the master. sda and scl lines typically need pull - up resistors to vdd. the maximum bus speed is 400 khz . the slave address of the mpu - 60x0 is b110100x whic h is 7 bits long. the lsb bit of the 7 bit address is determined by the logic level on pin ad0 . this allows two mpu - 60x0 s to be connected to the same i 2 c bus. when used in this configuration, the address of the one of the devices should be b1101000 (pin a d0 is logic low) and the address of the other should be b1101001 (pin ad0 is logic high). 9.3 i 2 c communications protocol start (s) and stop (p) conditions communication on the i 2 c bus starts when the master puts the start condition (s) on the bus, which is defined as a high - to - low transition of the sda line while scl line is high (see figure below). the bus is considered to be busy until the master puts a stop condition (p) on the bus, which is defined as a low to high transition on the sda line while scl i s high (see figure below).
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 35 of 54 additionally, the bus remains busy if a repeated start (sr) is generated instead of a stop condition. start and stop conditions data format / acknowledge i 2 c data bytes are defined to be 8 - bits long. there is no restriction to the number of bytes transmitted per data transfer. each byte transferred must be followed by an acknowledge (ack) signal. the clock for the acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal by pulling down sda and holding it low during the high portion of the acknowledge clock pulse. if a slave is busy and cannot transmit or receive another byte of data until some other task has been performed, it can hold scl low, thus forcing the master into a wait state. normal data transfer resumes when the slave is ready, and releases the clock line (refer to the following figure). acknowledge on the i 2 c bus s d a s c l s s t a r t c o n d i t i o n s t o p c o n d i t i o n p d a t a o u t p u t b y t r a n s m i t t e r ( s d a ) d a t a o u t p u t b y r e c e i v e r ( s d a ) s c l f r o m m a s t e r s t a r t c o n d i t i o n c l o c k p u l s e f o r a c k n o w l e d g e m e n t a c k n o w l e d g e n o t a c k n o w l e d g e 1 2 8 9
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 36 of 54 communications after beginning communications with the start condition (s), the master sends a 7 - bit slave address followed by an 8 th bit, the read/write bit. the read/write bit indicates whether the master is receiving data from or is writing to the slave device. then, the master relea ses the sda line and waits for the acknowledge signal (ack) from the slave device. each byte transferred must be followed by an acknowledge bit. to acknowledge, the slave device pulls the sda line low and keeps it low for the hi gh period of the scl line. data transmission is always terminated by the master with a stop condition (p), thus freeing the communications line. however, the master can generate a repeated start condition (sr), and address another slave without first generating a stop condition ( p). a low to high transition on the sda line while scl is high defines the stop condition. all sda changes should take place when scl is low, with the exception of start and stop conditions. complete i 2 c data transfer to wri te the internal mpu - 60x0 registers, the master transmits the start condition (s), followed by the i 2 c address and the write bit (0). at the 9 th clock cycle (when the clock is high), the mpu - 60x0 acknowledges the transfer. then the master puts the register address ( ra) on the bus. after the mpu - 60x0 acknowledges the reception of the register address, the master puts the register data onto the bus. this is followed by the ack signal, and data transfer may be concluded by the stop condition (p). to write mult iple bytes after the last ack signal, the master can continue outputting data rather than transmitting a stop signal. in this case, the mpu - 60x0 automatically increments the register address and loads the data to the appropriate register. the following fig ures show single and two - byte write sequences. single - byte write sequence burst write sequence master s ad+w ra data p slave ack ack ack master s ad+w ra data data p slave ack ack ack ack s d a s t a r t c o n d i t i o n s c l a d d r e s s r / w a c k d a t a a c k d a t a a c k s t o p c o n d i t i o n s p 1 C 7 8 9 1 C 7 8 9 1 C 7 8 9
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 37 of 54 to read the internal mpu - 60x0 registers, the master sends a start condition, followed by the i 2 c address and a write bit, and then the register address that is going to be read. upon receiving the ack signal from the mpu - 60x0, the master transmits a start signal followed by the slave address and read bit. as a result, the mpu - 60x0 sends an ack signal and the data. the communication ends with a not acknowledge (nack) signal and a stop bit from master. the nack condition is defined such that the sda line remains high at the 9 th clock cyc le. the following figures show single and two - byte read sequences. single - byte read sequence burst read sequence 9.4 i 2 c terms signal description s start condition: sda goes from high to low while scl is high ad slave i 2 c address w write bit (0) r read bit (1) ack acknowledge: sda line is low while the scl line is high at the 9 th clock cycle nack not - acknowledge: sda line stays high at the 9 th clock cycle ra mpu - 60x0 internal register address data transmit or received data p stop condition: sda going from low to high while scl is high master s ad+w ra s ad+r nack p slave ack ack ack data master s ad+w ra s ad+r ack nack p slave ack ack ack data data
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 38 of 54 9.5 spi interface ( mpu - 6000 only) spi is a 4 - wire synchronous serial interface that uses two control lines and two data lines. the mpu - 6000 always operates as a slave device during standard master - slave spi operation. with respect to the master, the serial clock output (sclk), the serial data output (sdo) and the serial data input (sdi) are shared among the slave devices. each spi slave device requires its own chip select (/cs) line from the master. /cs goes low (active) at the start of transmission and goes back high (inactive) at the end . o nly one /cs line is active at a time, ensuring that only one slave is selected at any given time. the /cs lines of the non - selected slave devices are held high, caus ing the ir sdo line s to remain in a high - impedance (high - z) state so that they do not int erfere with any active devices. spi operational features 1. data is delivered msb first and lsb last 2. data is latched on the rising edge of sclk 3. data should be transitioned on the falling edge of sclk 4. the maximum frequency of sclk is 1mhz 5. spi read and write op erations are completed in 16 or more clock cycles (two or more bytes). the first byte contains the spi address, and the following byte(s) contain(s) the spi data. the first bit of the first byte contains the read/write bit and indicates the read (1) or wr ite (0) operation. the following 7 bits contain the register address. in cases of multiple - byte read/writes, data is two or more bytes: spi address format msb lsb r/w a6 a5 a4 a3 a2 a1 a0 spi data format msb lsb d7 d6 d5 d4 d3 d2 d1 d0 6. supports single or burst read/writes. t y p i c a l s p i m a s t e r / s l a v e c o n f i g u r a t i o n s p i m a s t e r s p i s l a v e 1 s p i s l a v e 2 / c s 1 / c s 2 s c l k s d i s d o / c s s c l k s d i s d o / c s
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 39 of 54 10 serial interface considerations ( mpu - 6050 ) 10.1 mpu - 6050 supported interfaces the mpu - 6050 supports i 2 c communications on both its primary (microprocessor) serial interface and its auxiliary interface. 10.2 logic levels the mpu - 6050 s i/o logic levels are set to be either vdd or vlogic, as shown in the table below. i/o logic levels vs. aux _vddio aux_vddio microprocessor logic levels (pins: sda, scl, ad0, clkin, int ) auxillary logic levels (pins: aux_da, aux_cl) 0 vlogic vlogic 1 vlogic vdd note: t he power - on - reset value for aux _vddio is 0. vlogic may be set to be equ al to vdd or to another voltage. however, vlogic must be vdd at all times . when aux_vddio is set to 0 (its power - on - reset value), vlogic is the power supply voltage for both the microprocessor system bus and the auxiliary i 2 c bus, as shown in the figure of section 10 . 3 . when aux_vddio is set to 1, vlogic is the power supply voltage for the microproce ssor system bus and vdd is the supply for the auxiliary i 2 c bus, as shown in the figure of section 10 .4 .
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 40 of 54 10.3 logic levels diagram for aux _vddio = 0 the figure below depicts a sample circuit with a third party magnetometer attached to the auxiliary i 2 c bus. it shows logic levels and voltage connections for aux_vddio = 0. note: actual configuration will depend on the auxiliary sensors used. i/o levels and connections for aux _vddio = 0 notes: 1. aux_vddio determines the io voltage levels of aux_da and aux_cl (0 = set output levels relative to vlogic) 2. clkout is referenced to vdd. 3 . all other mpu - 6050 logic ios are referenced to vlogic . m p u - 6 0 5 0 3 r d p a r t y m a g n e t o m e t e r s d a a u x _ c l s c l a u x _ d a v d d _ i o v d d s a 0 i n t 2 i n t 1 s y s t e m p r o c e s s o r i o c l k i n s y s t e m b u s v l o g i c v l o g i c v l o g i c v d d v l o g i c ( 0 v - v l o g i c ) s c l s d a i n t f s y n c v l o g i c a d 0 ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v , v l o g i c ) ( 0 v , v l o g i c ) c s ( 0 v , v l o g i c ) v d d _ i o
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 41 of 54 10.4 logic levels diagram for aux_vddio = 1 the figure below depicts a sample circuit with a 3 rd party magnetometer attached to the auxiliary i 2 c bus. it shows logic levels and voltage connections for aux_vddio = 1 . this configuration is useful when the auxiliary sensor has only one supply for logic an d power. note: actual configuration will depend on the auxiliary sensors used. i/o levels and connections for two example power configurations ( aux _vddio = 1) notes: 1. aux_vddio determines the io voltage levels of aux_da and aux_cl. aux_vddio = 1 sets output levels relative to vdd . 2. 3 rd - party auxiliary device logic levels are referenced to vdd. setting int1 and int2 to open drain configuration provides voltage compatibility when v dd vlogic . when vdd = vlogic, int1 and int2 may be set to push - pull outputs, and external pull - up resistors are not needed. 3. clkout is referenced to vdd. 4. all other mpu - 6050 logic ios are referenced to vlogic. v l o g i c v d d c o n f i g u r a t i o n 1 c o n f i g u r a t i o n 2 1 . 8 v 5 % 2 . 5 v 5 % 3 . 0 v 5 % 3 . 0 v 5 % v o l t a g e / c o n f i g u r a t i o n a u x _ v d d i o 1 1 m p u - 6 0 5 0 3 r d p a r t y m a g n e t o m e t e r s d a a u x _ c l s c l a u x _ d a v d d v d d a d d r i n t 2 i n t 1 s y s t e m p r o c e s s o r i o c l k i n s y s t e m b u s v l o g i c v l o g i c v d d v d d v l o g i c s c l s d a i n t f s y n c v l o g i c a d 0 ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) 0 v - v d d 0 v - v d d ( 0 v , v l o g i c ) 0 v - v d d v l o g i c ( 0 v C v l o g i c ) ( 0 v C v l o g i c ) v d d _ i o
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 42 of 54 11 assembly this section provides general guidelines for assembling invensense micro electro - mechanical systems (mems) gyros packaged in quad flat no leads package ( qfn) surface mount integrated circuits. 11.1 orientation of axes the diagram below shows the orientation o f the axes of sensitivity and the polarity of rotation. note the pin 1 identifier ( ? ) in the figure. m p u - 6 0 0 0 m p u - 6 0 5 0 + z + x + y o r i e n t a t i o n o f a x e s o f s e n s i t i v i t y a n d p o l a r i t y o f r o t a t i o n + z + y + x
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 43 of 5 4 11.2 package dimensions 24 lead qfn (4x4x0.9) mm nipdau lead - frame finish symbols dimensions in millimeters min nom max a 0.85 0.90 0.95 a1 0.00 0.02 0.05 b 0.18 0.25 0.30 c --- 0.20 ref --- d 3.90 4.00 4.10 d2 2.65 2.70 2.75 e 3.90 4.00 4.10 e2 2.55 2.60 2.65 e --- 0.50 --- f (e-b) --- 0.25 --- k 0.25 0.30 0.35 l 0.30 0.35 0.40 l1 0.35 0.40 0.45 s 0.05 --- 0.15 c o .3 d d2 1 6 7 18 13 12 e pin 1 identifier is a laser marked fe a ture on t o p 24 19 e b c a1 a on 4 corners - lead dimensions s s l e2 l1 f
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 44 of 54 11.3 pcb design guidelines the pad diagram using a jedec type extension with solder rising on the outer edge is shown below. the pad dimensions table shows pad sizing (mean dimensions) recommended for the mpu - 60x0 product. jedec type extension with solder rising on outer edge p cb layout diagram symbols dimensions in millimeters nom nominal package i/o pad dimensions e pad pitch 0.50 b pad width 0.25 l pad length 0.35 l1 pad length 0.40 d package width 4.00 e package length 4.00 d2 exposed pad width 2.7 0 e2 exposed pad length 2.6 0 i/o land design dimensions (guidelines ) d3 i/o pad extent width 4.80 e3 i/o pad extent length 4.80 c land width 0.35 tout outward extension 0.40 tin inward extension 0.05 l2 land length 0.80 l3 land length 0.85 p cb dimensions table (for pcb lay - out diagram )
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 45 of 54 11.4 assembly precautions 11.4.1 gyroscope surface mo u nt guidelines invensense mems gyros sense rate of rotation. in addition, gyroscopes sense mechanical stress coming from the printed circuit board ( pcb ) . this pcb stress can be minimized by adhering to certain design rules: when using mems gyroscope components in plastic packages, pcb mounting and assembly can cause package stress . this package stress in turn can affect the output offset and its value over a wide range of temperatures. this stress is caused by the mismatch between the coefficient of linear thermal expansion (c t e) of the package material and the pcb. care must be taken to avoid package stress due to mounting. traces connected to pads should be as symmetric a s possible. maximizing s ymmetry and balance for pad connection will help component self alignment and will lead to better control of solder paste reduction after reflow. any material used in the surface mount assembly process of the mems gyroscope should be free of restricted rohs elements or compounds. pb - free solders should be used for assembly. 11.4.2 exposed die pad precautions the mpu - 60x0 has very low active and standby current consumption. the exposed die pad is not required for heat sinking, and should not be soldered to the pcb . failure to adhere to this rule can induce performance changes due to package thermo - mechanical stress. there is no electrical connection between the pad and the cmos. 11.4.3 trace routing routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited. routed active signals may harmonically couple with the gyro mems devices, compromising gyro response. these devices are designed with the drive freque ncies as follows: x = 333khz, y = 303khz, and z=273khz. to avoid harmonic coupling dont route active signals in non - shielded signal planes directly below, or above the gyro package. note: for best performance, design a ground plane under the e - pad to r educe pcb signal noise from the board on which the gyro device is mounted. if the gyro device is stacked under an adjacent pcb board, design a ground plane directly above the gyro device to shield active signals from the adjacent pcb board. 11.4.4 component pla cement do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes at a distance of less than 6 mm from the mems gyro. maintain generally accepted industry design practices for component placement near the mp u - 60x0 to prevent noise coupling and thermo - mechanical stress. 11.4.5 pcb mounting and cross - axis sensitivity orientation errors of the gyroscope and accelerometer mounted to the printed circuit board can cause cross - axis sensitivity in which one gyro or accel r esponds to rotation or acceleration about another axis , respectively . f or example, the x - axis gyroscope may respond to rotation about the y or z axes. the orientation mounting errors are illustrated in the figure below.
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 46 of 54 the t ab le below shows the cross - axis sensitivity as a percentage of the gyroscope or accelerometers sensitivity for a given orientation error , respectively . cross - axis sensitivity vs. orientation error orientation error ( or ) in or in) 0o 0% 0.5o 0.87% 1o 1.75% the specification s for cross - axis sensitivity in section 6.1 and section 6.2 include the effect of the die orientation error with respect to the package. 11.4.6 mems handling instructions mems (micro electro - mechanical systems) are a time - proven, robust technology used in hundreds of millions of consumer, automotive and industrial products. mems devices consist of microscopic moving mechanical structures. they differ from conventional ic products , even though they can be found in similar packages. therefore, mems devices require different handling precautions than conventional ics prior to mounting onto printed circuit boards (pcbs). the mpu - 60x0 has been qualified to a shock tolerance of 10,000 g . invensense packages its gyroscopes as it deems proper for protection against normal handling and shipping. it recommends the following handling precautions to prevent potential damage. ? do not drop i ndividually packaged gyroscopes, or trays of g yroscopes on to hard surfaces. components placed in trays could be subject to g - forces in excess of 10,000 g if dropped. ? printed circuit boards that incorporate mounted gyroscopes should not be separated by manually snapping apart. this could also create g - forces in exce ss of 10,000 g. ? do not clean mems gyroscopes in ultrasonic baths. ultrasonic baths can induce mems damage if the bath energy causes excessive drive motion through resonant frequency coupling. 11.4.7 esd considerations establish and use esd - safe handling precautio ns when unpacking and handling esd - sensitive devices. p a c k a g e g y r o & a c c e l a x e s ( ) r e l a t i v e t o p c b a x e s ( ) w i t h o r i e n t a t i o n e r r o r s ( a n d ) m p u - 6 0 0 0 m p u - 6 0 5 0 x y z
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 47 of 54 ? store esd sensitive devices in esd safe containers until ready for use. the tape - and - reel moisture - sealed bag is an esd approved barrier. the best practice is to keep the units in the original moisture sealed bags until ready for assembly. restrict all device handling to esd protected work areas that measure less than 200v static charge . ensure that all workstations and personnel are properly grounded to prevent esd. 11.4.8 reflow specification qualification reflow: the mpu - 60x0 was qualified in accordance with ipc/jedec j - std - 020d.01. this standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and mechanical damage during the solder reflow attachment phase of pcb assembly . the qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak cycle ( in a tempera ture humidity oven), and three consecutive solder reflow cycles, followed by func tional device testing . the peak solde r reflow classifica tion temperature requirement for package qualification is (260 +5/ - 0c) for lead - free soldering of components measuring less than 1.6 mm in thickness. the qualification profile and a table explaining the set - points are shown below: temperature [ c] time [seconds] solder reflow profile for qualification lead - free ir/convection preheat 60 - 120sec t smax t smin t liquidus t pmin t pmax liquidus 60 - 120sec 10 - 30sec t ramp - up ( < 3 c/sec) t ramp - down ( < 4 c/sec) t room - pmax (< 480sec) a b c d e f g h i
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 48 of 54 t emperature set po ints corresponding to reflow profile above step setting constraints temp (c) time (sec) max. rate (c/sec) a t room 25 b t smin 150 c t smax 200 60 < t bc < 120 d t liquidus 217 r ( t liquidus - t pmax) < 3 e t pmin [255c, 260c] 255 r ( t liquidus - t pmax) < 3 f t pmax [ 260c, 265c] 260 t af < 480 r ( t liquidus - t pmax) < 3 g t pmin [255c, 260c] 255 10< t eg < 30 r ( t pmax - t liquidus) < 4 h t liquidus 217 60 < t dh < 120 i t room 25 notes: c ustomer s must never exceed the classification temperature (t pmax = 260c). all temperatures refer to the topside of the qfn package, as measured on the package body surface. production reflow: check the recommendations of your solder manufacturer. for optimum results, use lead - free solders that have lower specified temperature profiles (t p max ~ 235 c). also use lower ramp - up and ramp - down rates than those used in the qualification profile . n ever exceed the maximum conditions that we used for qualificati on , as these represent the maximum tolerable ratings for the device. 11.5 storage specification s the storage specification of the mpu - 60x0 conforms to ipc/jedec j - std - 020 d.01 moisture sensitivity level (msl) 3. calculated shelf - life in moisture - sealed bag 12 months -- stor age conditions: <40c and <90% rh after opening moisture - sealed bag 168 ho urs -- stora ge conditions: ambient 30c at 60% 11.6 package marking specification package marking specification i n v e n s e n s e m p u 6 0 0 0 x x x x x x - x x x x y y w w x l o t t r a c e a b i l i t y c o d e f o u n d r y c o d e p a c k a g e v e n d o r c o d e r e v c o d e y y = y e a r c o d e w w = w o r k w e e k t o p v i e w p a r t n u m b e r i n v e n s e n s e m p u 6 0 5 0 x x x x x x - x x x x y y w w x t o p v i e w
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 49 of 54 11.7 tape & reel specification tape dimensions reel outline drawing reel dimensions and package size package size reel (mm) l v w z 4x4 330 100 13.2 2.2
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 50 of 54 tape and reel specification reel specifications quantity per reel 5, 000 reels per box 1 boxes per carton (max) 5 pcs/carton (max) 25 ,000 11.8 label barcode lab el location of label on reel label reel cover t ape (anti-static) carrier t ape (anti-static) t erminal t ape user direction of feed invensense invensense invensense invensense pin 1 package orientation i n v e n s e n s e p b -f r e e ca t e go r y ( e4 ) h f d ev i c e ( 1 p ) : m p u - 605 0 p o : hu b r ee l q t y ( q ) : 500 0 l o t 1 ( 1 t ) : q 2 r 784 - f 1 d / c ( d ) : 111 8 q t y ( q ) : 300 0 l o t 2 ( 1 t ) : q 3 v 215 - g 1 d / c ( d ) : 110 7 q t y ( q ) : 200 0 r ee l d a t e : 18 / 05 / 1 1 q c s t a m p :
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 51 of 54 11.9 packaging reel C with barcode & vacuum - sealed m oisture msl3 label caution labels barrier bag with esd, msl3, c aution , and barcode l abels caution label esd label inner bubble wrap pizza box pizza boxes placed in foam - outer shipper label lined shipper box
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 52 of 54 11.10 representative shipping carton label
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 53 of 54 12 reliability 12.1 qualification test policy invensenses products complete a qualification test plan before being released to production. the qualification test plan for the mpu - 60x0 followed the jesd 47 h .01 standards, stress - test - driven qualification of integrated circuits, with the individual tests described below. 12.2 qualification test plan accelerated life tests test method/condition lot quantity sample / lot acc / reject criteria (htol/lfr) high temperature operating life jedec jesd22 - a108d, dynamic, 3.63v biased, tj>125c [read - points 168, 500, 1000 hours] 3 77 (0/1) (hast) highly accelerated stress test (1) jedec jesd22 - a118 a condition a, 130c, 85%rh, 33.3 psia., unbiased, [read - point 96 hours] 3 77 (0/1) (hts) high temperature storage life jedec jesd22 - a103d, cond. a, 125c non - bias bake [read - points 168, 500, 1000 hours] 3 77 (0/1) device component level tests test method/condition lot quantity sample / lot acc / reject criteria (esd - hbm) esd - human body model jedec js - 001 - 2010 , (1.5kv) 1 3 (0/1) (esd - mm) esd - machine model jedec jesd22 - a115c, (200v) 1 3 (0/1) (lu) latch up jedec jesd - 78d class ii (2), 125c; 10 0ma 1 6 (0/1) (ms) mechanical shock jedec jesd22 - b104c, mil - std - 883, method 2002.5, cond. e, 10,000 gs , 0.2ms, x, y, z C 6 directions, 5 times/direction 3 5 (0/1) (vib) vibration jedec jesd22 - b103b, variable frequency (random), cond. b, 5 - 500hz, x, y, z C 4 times/direction 3 5 (0/1) (tc) temperature cycling (1) jedec jesd22 - a104d condition n [ - 40c to +85c], soak mode 2 [5], 100 cycles 3 77 (0/1) board level tests test method/condition lot quantity sample / lot acc / reject criteria (bms) board mechanical shock jedec jesd22 - b104c,mil - std - 883, method 2002.5, cond. e, 10000 gs , 0.2ms, + - x, y, z C 6 directions, 5 times/direction 1 5 (0/1) (btc) board temperature cycling (1) jedec jesd22 - a104d condition n [ - 40c to +85c], soak mode 2 [5], 100 cycles 1 40 (0/1) (1) tests are preceded by msl3 preconditioning in accordance with jedec jesd22 - a113f
mpu - 6000/mpu - 6050 product specification do cument number: ps - mpu - 6000a - 00 revision: 3.3 release date: 5/16/2012 54 of 54 13 environmental compliance the mpu - 6000/mpu - 6050 is rohs and green compliant. the mpu - 6000/mpu - 6050 is in full environmental compliance as evidenced in report hs - mpu - 6000 , materials declaration data sheet. environmental declaration disclaimer: invensense believes this environmental information to be correct but cannot guarantee accuracy or completeness. conformity documents for the above component constitutes are on file. invensense subcontracts manufacturing and the information containe d herein is based on data received from vendors and suppliers, wh ich has not been validated by invensense. this information furnished by invensense is believed to be accurate and reliable. however, no responsibility is assumed by in vensense for its use, or for any infringements of patents or other rights of third parties that may result from its use. specifications are subject to change without notice. invensense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. invensense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. invensense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. this includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. certain intellectual prop erty owned by invensense and described in this document is patent protected. no license is granted by implication or otherwise under any patent or patent rights of invensense. this publication supersedes and replaces all inform ation previously supplied. tr ademarks that are registered trademarks are the property of their respective companies. invensense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass - destructive weapons or for any other we apons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equ ipment. invensense ? is a registered trademark of invensense, inc. mpu tm , mpu - 6000 tm , mpu - 6050 tm , mpu - 60x0 tm , digital motion process or ? , dmp ? , motion processing unit ? , motionfusion?, motioninterface? , motiontracking? , and motionapps? are trademarks of invensense, inc. ?2011 invensense, inc. all rights reserved.

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